CuP8 Brazing Filler Metal
CuP8 is a copper-phosphorous brazing alloy, with excellent flow properties. It can be used to join copper to copper or copper based base materials. Copper-phosphorus brazing filler has been widely used in brazing copper and copper alloys due to its good process performance and low price. The addition of phosphorus can reduce the melting point of the solder and play a role in self-brazing when brazing copper in the air.
Note: Powder/Paste are affordable.

Copper Based Brazing Alloy

AWS

Chemical Compositionwt%)

Solid Liquid Phase棩

Brazing Temperature棩

BCu100/BCu-1

Cu99.9

1083

1093-1149

CuSn10

Sn9-11/Cu Bal

840-1000

1020-1090

CuSn19Ti10

Sn18-20/Ti9-11/Cu Bal

850-880

880-930

BCuP-2/BCu92P

P7-9/Cu Bal.

710-770

720-843

CuSn3P7

P6-8/Sn2-4/Cu Bal.

630-670

710-810

BCuP-9/BCu86SnP

P6-7/Sn6-7/Cu Bal.

650-700

700-810

BCuP-8/BCu76AgP

Ag17.2-18/P6-6.7/Cu Bal

643-666

670-686

BCu86SnPNi

P4.8-6.5/Sn7-8/Ni0.5-1.5/Cu Bal

612-682

682-812

CuSn15.6PNi4.2

P4.8-6.5/Sn7-8/Ni0.5-1.5/Cu Bal

585-605

605-800

Cu595/BCu84NiMn

Mn11-13/Ni2-4/Cu Bal

970-990

1000-1050

CuMn38Ni10

Mn37-39/Ni9-11/Cu Bal

900-950

950-1070

BCuMnCo

Mn9-11/Co2-4/Cu Bal

980-1030

1050-1100

BCu54Zn

Cu53-55/Zn Bal

885-888

910-955

Cu55ZnMnNi

Cu54-56/Ni6-8/Mn4-6/Zn Bal

910-933

940-1040

Product Properties
1. FormPowder/Paste
2. Solid Liquid Phase643-666
3. Brazing Temperature: 670-686
4. Suitable Base MaterialCopper/Copper Alloy

Application
It is widely used in Copper/Copper Alloy brazing

Hot Tags: cup8 brazing filler metal, China, suppliers, factory, customized, price, cheap, for coating, for 3D printing, Niobium Powder, 18Ni300 Powder, BNi-7 Brazing Filler Metal, High Purity Low Oxygen HDH Sponge Titanium Powder, Flake Silver Powder, BNi-5 Brazing Filler Metal

 

CuSn10 Brazing Filler Metal
It is often used for brazing steel and stainless steel in furnaces. Compared with pure copper brazing filler metals, the brazing temperature is slightly lower, which helps to prolong the service life of brazing furnaces and reduce the damage of base metal.
Note: Powder/Paste are affordable.

Copper Based Brazing Alloy

AWS

Chemical Compositionwt%)

Solid Liquid Phase棩

Brazing Temperature棩

BCu100/BCu-1

Cu99.9

1083

1093-1149

CuSn10

Sn9-11/Cu Bal

840-1000

1020-1090

CuSn19Ti10

Sn18-20/Ti9-11/Cu Bal

850-880

880-930

BCuP-2/BCu92P

P7-9/Cu Bal.

710-770

720-843

CuSn3P7

P6-8/Sn2-4/Cu Bal.

630-670

710-810

BCuP-9/BCu86SnP

P6-7/Sn6-7/Cu Bal.

650-700

700-810

BCuP-8/BCu76AgP

Ag17.2-18/P6-6.7/Cu Bal

643-666

670-686

BCu86SnPNi

P4.8-6.5/Sn7-8/Ni0.5-1.5/Cu Bal

612-682

682-812

CuSn15.6PNi4.2

P4.8-6.5/Sn7-8/Ni0.5-1.5/Cu Bal

585-605

605-800

Cu595/BCu84NiMn

Mn11-13/Ni2-4/Cu Bal

970-990

1000-1050

CuMn38Ni10

Mn37-39/Ni9-11/Cu Bal

900-950

950-1070

BCuMnCo

Mn9-11/Co2-4/Cu Bal

980-1030

1050-1100

BCu54Zn

Cu53-55/Zn Bal

885-888

910-955

Cu55ZnMnNi

Cu54-56/Ni6-8/Mn4-6/Zn Bal

910-933

940-1040

Product Properties
1. FormPowder/Paste
2. Solid Liquid Phase1083
3. Brazing Temperature: 1093-1149
4. Suitable Base MaterialCopper Alloy/Steel/Tantalum Niobium Supperalloy

Application
It is widely used in brazing, Powder Metallurgy Products, Catalysts, Thermally Conductive and Electrically Conductive Materials

Hot Tags: cusn10 brazing filler metal, China, suppliers, factory, customized, price, cheap, for coating, for 3D printing, CoCrW Powder, Rare Earth Products, AgCuTi Brazing Filler Metal, Molybdenum Powder, BNi-5 Brazing Filler Metal, CuSnTi Brazing Filler Metal

 

Superfine Silver Powder
Superfine silver powder is is an important material in electrical and electronic industry.It is a kind of precious metal powder widely used in electronic industry.
Electronic components production process, to use the silver powder slurry, which should have a special high purity (silver content greater than 99.99%), super fine (average particle size 0.2-0.4m), our company can stable production and provide this kind of silver powder.
Raw materials and processes that have important influence on the purity and morphology of silver powder: 1, reducing agent and reduction reaction rate; 2, additives; 3, reduction reaction temperature; 4, cleaning of silver powder.
Equipment affecting the size, size distribution and morphology of silver powderReduction kettledryer.

Application:
1. Antibacterial virus: approximately 0.1% of the nano silver on Escherichia coli, Staphylococcus staphylococcus and other dozens of pathogenic micro-organisms has a strong inhibitory and killing effect.
2. Anti-bacterial, anti-corrosion coatings can also be applied in the protection of cultural relics.
3. Used for preparation of the production of microelectronic components wiring, packaging, connectors.
4. Silver powder is used to produce electronic slurry of microelectronic devices and circuit miniaturization.
5. Efficient catalysts: Silver powder used as catalyst, high efficiency, selectivity, and can be used in the reaction process of methanol synthesis catalyst CO2 and H and the like.

6.Widely used in preparing thick film conductor paste

High Purity Tellurium Metal Ingot

Purity

99.99%, 99.999%, 99.99999%

Density (Tap)

6.24 g/cm3

Melting Point

449.5 C, 722 K, 841 F

Boiling Point

998 C (1,828 F; 1,271 K)

Electronegativity

2.01

Bandwidth

0.35eV

Specific Heat

0.0481 Cal/g/K @ 25C

Thermal Conductivity

2.35 W/m/K

Description:
Tellurium is a non-metallic element recovered as a by-product of electrolytic copper refining. Santech produces Tellurium in various shapes and sizes, such as ingot, powder and grains and a wide range of purity from 99.5% to 99.999%. Tellurium is a semiconductor that shows a greater electrical conductivity in certain directions which depends on atomic alignment, the conductivity increases slightly when exposed to light (photoconductivity). Tellurium is mainly used in the field of CdTe solar cell, Bi2Te3 thermo-electric compounds, metallurgy, vulcanization of rubber.
Specifications:

Element

Standard %

Element

Standard %

Cu

<0.001

Si

<0.001

Mg

<0.001

Al

<0.001

Bi

<0.001

Se

<0.002

Fe

<0.001

Pb

<0.002

As

<0.0005

Na

<0.003

S

<0.001

 

 

 

Purity

99.99%, 99.999%

Density

5.67 g/cm3

Melting Point

733 C

Boiling Point

1,260 C

Transparency Range

0.35 - 5.0 nm

Thermal Conductivity

30 mW/cm C

Particle Size

D50=10-12m

Description
Tellurium oxide is obtained by adding sulphuric acid to an alkaline solution of telluriumit remains stable in air and burns with a green flame giving off bioxide. It is an amphoteric substance and therefore can act both as an acid or as a base depending on the solution it is in. It reacts with acids to make tellurium salts and bases to make tellurites. It can be oxidized to telluric acid or tellurates. Tellurium dioxide is used as a catalyst for rubber and for metal surface treatment, corrosion resistance, identification of bacteria in vaccines.

Specifications:

Grade

ICP(OES)Inductively Coupled Plasma Optical Emission Spectroscopy
Concentration - (ppm by wt)

Element

Standard

Element

Standard

Cu

2.0

Ca

10.0

Ag

2.0

Fe

5.0

Mg

5.0

As

10.0

Sb

5.0

Al

5.0

Zn

10.0

Pb

10.0

Bi

10.0

Sn

2.0

 

Purity

99.9%, 99.99%

Crystal Structure

type, type

Particle Size (D50)

range of 1-5um, 5-10um, 10-20um

Density (Tap)

2.0 ~ 3.5 g/cm3

Melting point

817 C, 1090 K, 1503 F

Boiling point

1,890 C (3,430 F; 2,160 K)

BET Surface Area

0.9831 m2/g

Thermal expension coefficient

5.89 (10-6/C) at 101C

Description
Bismuth Trioxide is the important compound of Bismuth, beta-Bismuth Trioxide is orange color, and alpha Bismuth Oxide is the light yellow color which is widely used in the market which can be used as electronic materials, thermistor, glass coloring, varistor, surge arresters, CRT, fireproof paper, nuclear reactor fuel, electronic etc. Santech Materials has more than 10 years experience in production of the high purity Bismuth Trioxide, and provides full support for your business with the technical support, proffesional sales team and good after-sell service.
 
Specifications:

Element

Standard %

Element

Standard %

Li

0.0005

Na

0.005

K

0.003

Ca

0.003

Mg

0.0007

Al

0.002

Si

0.005

As

0.002

Cd

0.0005

Fe

0.001

Sn

0.0005

Cr

0.0008

Ni

0.0005

Cu

0.0008

Pb

0.0008

Ag

0.001

Sb

0.0008

Cl

0.001

Sulfate Radical SO4

0.001

Loss on Ignition

0.3

Unsolvable in HNO3

0.01

D50

1 ~ 5 micron

 

 

 

 

 


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